Compact Magnetron Sputter System

Applicable to various R&D fields that sputter deposition of metals and ceramic materials is necessary.Application areas: semiconductor, display, solar cell, biochips, new materials, nanomaterials, and sample preparations, etc.Special FeaturesRF or DC magnetron sputter for multipurpose R&D.RF to DC power supply easily changed without hardware change.Deposition available for various materials of metals, carbon materials, metal oxides and metal nitrides, etc.Small space needed for installation.Efficient deposition through easy operation.High performance to low cost.Target shutter, view port shutter and chamber liners installed.Ar gas introduced between cathode shield and target for high sputter yield.Reactive sputtering also available.SpecificationsTarget size: 2in to 3inSystem control: PLC-based touch panelSubstrate holder size: normally up to 3in waferSubstrate heating: basically not heated or water-cooled (optionally heated up to 300oC)Bias plasma applied to substrate holder (optional)Target to substrate distance: 60 to 100mm controllableSputter power supply: 600W RF power supply(13.56MHz) with matching circuit (DC power optional)Process gas: Ar, O2 (N2 optional)Vacuum gauge: low and high vacuum gaugesBase pressure: <5.0E-6TorrPumping system of TMP (51 l/s)+rotary oil pump(200 l/min) (dry pump is optionally available)Water: <20oC, 2kg/cm2, 20l/minCompressed air: 5kg/cm2Weight: 100kgDimension: 561mm(W) x 548mm(D) x 519mm(H)