High-freqency impedance matcher (Pd No. : 3020994)

High-freqency impedance matcher (Pd No. : 3020994)

High-freqency impedance matcher (Pd No. : 3020994) Made in Korea

Description

[Product Description]:

*Overview

  • A CSP substrate utilizing conductive solder bumps for electrical connection between die and substrate
  • Suitable for faster data transmission by using flip chip bonding

[Product Features]:


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