FLP-14

FLP-14

Description

FLP-14: MAX Die Size: 2.58 x 2.07mm Pad Size: 2.80x 2.30mm Die Attach: Solder/Epoxy Lead Frame Lead Finish: Sn 100% Wire Bonding: Au Wire 20~25占쏙옙 Wafer Thickness: 170/290占쏙옙 Mold Compound: Halogen Free Marking: Laser Packing Option: Tube, T & R


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