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Hard coating, Ferromagnetic devices
Special Features
FVAS system for small scale production with 90 degree macro-particle filtering.
Magnet array designed specially for arc stabilization.
Constantly exhibits high ionization ratio.
Average throughput Up to 5,000 per year.
Specifications
Wafer capacity : 1 X 4"
Dimension : 1,030L ×
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Metal, ceramic, and alloy depositions for R&D in OLED fields.
Special Features
Cluster sputtering system for TCO deposition with two sputtering chambers and one glove box.
Robot transfer chamber between chambers and glove box.
Cassette loading type with glass holder.
Three tiltable 8" sputter guns and extra sputter gun ports in each
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Optical waveguide
Barrier layer
Special Features
SiO2 PECVD system for R&D and small scale production.
Excellent thickness and reflective index uniformity in deposited layer (avg. 7µm).
Highly smooth surface(RMS roughness of deposited layer : 30.6Ã…).
Transformer coupled high density plasma.
Specifications
Wafer capacity : 1 ×
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Coatings for PDP electrode protection(eg. MgO etc.)
Special Features
In-line system with 4 arc guns for dielectric materials deposition on 70 inch glass(base pressure: 1 X 10-6 Torr).
Equiped with mechanical, booster and cryogenic pumping system.
Automatically controlled in substrate moving.
Average throughput : Up to 30,000 sheets per
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Applicable to various R&D fields that sputter deposition of metals and ceramic materials is necessary.
Application areas: semiconductor, display, solar cell, biochips, new materials, nanomaterials, and sample preparations, etc.
Special Features
RF or DC magnetron sputter for multipurpose R&D.
RF to DC power supply easily changed without
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We deal with various high-quality window films manufactured in Korea. We can supply all products, including glue tinted films, dyed films, sputtered films, ceramic films, IR films, and safety films. We supply them at low competitive prices by cutting the production costs based on long accumulated technology.
In particular, our ceramic film does
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Graphene synthesis
Special Features
Multi-functional CVD system combined with ICP CVD and probe station.
Maximum substrate temperature: 1,000°C.
Automatic loading available during susceptor heating.
High density plasma source.
PC-control system.
Specifications
Wafer capacity : 6" wafer x 1
Average throughput: 4,800
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Optical coating applications
Hard coatings on plastics
Functional coating applications
Special Features
In-line electron beam evaporation system for a mass production with multiple beam sources.
Automatic process control through PC interfacing.
Carrier loading capability : 600 carriers/load, 2x27" sheets/carrier.
Standard tact time:
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Optical coatings
Hard coatings
Metal coatings
Polymer surface modifications
Coatings for flat panel display electorates
Special Features
In-line sputter system with 8ea linear sputter guns for R&D and a small-scale production.
Automatic process control through PLC interfacing.
Carrier loading capability : 2x24"
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Specifications
Dimension : 1645(L)X1043.5(H)X630(W) (mm3)
Wafer Size : 6 inch
Motor Moving : 5mm/min ~ 300mm/min
Accuracy : 100µm
Control : Touch Panel
Main Power : 220V, 3phase,
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OLED barrier layers(ex. SiOx, SiNx, SiONx, etc)
Special Features
SiOx and SiNx rf-PECVD system for R&D and small scale production.
Designed to be compatible with OLED cluster system.
Transformer-coupled high density plasma source.
System and process controlled automatically by PC.
Specifications
Substrate : 100x100mm2, 150x150mm2
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X-ray mirror
Neutron mirror
Reflective optics for EUV lithography
Special Features
Ion beam sputtering system for precision optics.
Layer deposition and deposited layer milling, sequentially processed, with two ion guns.
Substrate rotation for uniform deposition.
Automatic distance control between ion guns and substrate.
Target rotated
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Roll-to-roll sputter system for the flexible solar cell
The system apparatus for depositing the base electrode / TCO top layer of flexible solar cell.
This equipment which forms the base electrode of flexible solar cell is equipped with the plasma cathode that has the power density for the deposition process. The system is able to produce
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Metal coating
Metal Nitride coating
Special Features
Arc ion plating system for a functional coating.
Low temperature coating is possible.
High deposition rate and ionization degree, good adhesion.
Easy process control and cost effective
Specifications
Chamber body : Ø800×H1200(Effective : Ø600×H1,000)
Heater : Mo Plate
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CNTs growth
Special Features
Small DC arc discharge system for CNT(Carbon Nano Tube) synthesis.
SWNT and MWNT synthesis.
Specifications
Carbon rod : ~12phi x 300mm
Average throughput : Up to 10kg per year
Dimension : 1000L x 1400H x 650W(mm3)
Power : DC 2kW
Gas : He/H2/Ar
Pump : rotary(600
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Optical device
Optical wave guide
Passivation layer
Special Features
RF sputtering system for R&D and small scale production.
Excellent thickness uniformity and surface morphology in deposited layers.
Silicon and reactive silicon oxide deposition.
Automatically movable substrate holder.
Specifications
Wafer capacity : 1 x
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Roll-to-roll sputter system for the window solar film
The system apparatus for depositing the high quality window solar film
The system, window film deposition installation, is used to screen the rays of the sun(infrared rays, ultraviolet rays etc) for the building and automotive in use and in a position to produce a single layer and multi
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Plasma modifications and PECVD of injection mold surface for forming automobile plastic parts.
Low friction and wear-resistant applications using plama nitriding and DLC deposition to various types of metal products.
Special Features
Batch type of large area plasma treatment, plasma nitriding & PECVD system.
(chamber size: ID:2,100mm,
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Hard coating
Tribological coating
Optical coating
Special Features
Ion-assisted unbalanced magnetron sputtering system for DLC deposition.
Highly charged partices with a high kinetic energy.
High degree of flexibility for various substrate materials.
Average throughput : Up to 720,000 pcs per year
Specifications
Loading capacity :