SJ-2063SJ-2063 is one component resin casting compound, which has been especially developed for the purpose of applying to the encapsulation of CHIP LED.
FeaturesSuperior transparent color, excellent moisture resistance, high reliability against heat and shock, resistance to discoloration when operating under high-temperature conditions, outstanding adhesiveness, efficiency of work and economic value of productSpecification: one-component type heat-cured adhesive
Epoxy Bond SJ-2063
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Payment & Shipping Conditions:
- Payment: We accept payment through Paypal Only.
- Shipping: We will ship the catalog once the payment is received. And you will be receiving the catalog with in 10 -14 busines days. Shipping might be delayed in due to international shipping conditions which is depends on the countries receiveing. In case hard copy of catalog is not available then we will ship the soft copy.
- Refund: We can refund the order before shipping process was initiated. Incase Catalog not available, we will make sure to refund the order.
- Note: This is a Catalog Produt.
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