HID Module

HID Module

HID Module Made in Korea

Description

Patternized design of electric circuits allows for pastes for malleability (Au, Ag, Pt/ Ag,

Pd/Ag), resistance (oxidized ruthenium, ermet families), and protection (glass) to be

printed, dried, and fired for the attachment of all kinds of active and passive elements and assemblies.

Printing Process,DRY process,FIRING Process,Trimming Process,SMT Process,Lead insert/Dip Soldering

Macrography Process,Cotting/Lead Cutting,final test


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